Xtalic’s Nanostructured Nickel-Gold Alloy Enables Fine Pitch Interconnects to Carry More Current, Maintain Strength at Higher Temperatures

MARLBOROUGH, MASSACHUSETTS, USA — March 11, 2020 — Xtalic Corporation announces a new patented, nanostructured nickel-gold (Ni-Au) alloy for use in the manufacture of crucial electrical contacts where high conductivity and strength must be maintained at elevated temperatures.

www.xtalic.com/press-releases/2020/03/xtalics-nanostructured-nickel-gold-alloy-enables-fine-pitch-interconnects-to-carry-more-current-maintain-strength-at-higher-temperatures/